Manufacturing Expertise
Specialized in advanced IC package substrates, including BGA, FCCSP, SiP, memory and module substrates.
Industry Experience
Focused on semiconductor package substrate manufacturing since 2009.
Technical Capabilities
Supporting fine-line, multilayer and ultrathin substrate solutions for diverse packaging applications.
Engineering Team
Experienced process and engineering teams supporting prototyping, customization and volume production.
IC Package Substrates
High-density package substrate solutions for semiconductor packaging, including BGA, FCCSP, SiP, memory and module applications.
Featured Products
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（0.1-0.4mm）Gold Plating Ultrathin Rigid PCB Board
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0.15mm Gold Finger SD card substrate manufacture
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0.15mm IC assembly package substrate For semiconductor package
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0.15mm Thickness 2 Layers IC Package Substrate For memory package
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0.1mm 0.4mm Thickness L/S 35um Ultra Thin Pcb
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0.26mm BT BGA IC Substrate Board manufacture